23119 I-ejenti Yokuhlakaza Izinga
Izici & Izinzuzo
- Ayiqukethe i-APEO noma i-PAH, njll. Ilingana nezimfuneko zokuvikela imvelo.
- Ukusebenza kahle kokulinganisa.Inganciphisa isikhathi sokudaya, ithuthukise ukusebenza kahle kokukhiqiza futhi yonge amandla.
- Ikhono eliqinile lokuhlehlisa.Ingakwazi ukwehlisa ngempumelelo izinga lokuqala lokudaya futhi ixazulule inkinga yesici sokudaya esibangelwa ukudaywa ngasikhathi sinye kodayi abaxubile.
- Igwebu eliphansi kakhulu.Asikho isidingo sokwengeza i-ejenti yokukhipha amagwebu.Yehlisa izindawo ze-silicone engutsheni kanye nokungcoliswa kwezinto zokusebenza.
- Ithuthukisa indawo yokusetshenziswa kodayi abahlakazayo, ikakhulukazi umphumela wokusetshenziswa kodayi abasezingeni eliphansi.
Izakhiwo Ezijwayelekile
Ukubukeka: | Uketshezi olumhlophe lobisi |
Ionicity: | I-Anionic / Nonionic |
Inani le-pH: | 6.0±1.0 (1% isixazululo esinamanzi) |
Ukunyibilika: | Incibilika emanzini |
Okuqukethwe: | 80% |
Isicelo: | Imicu ye-polyester ne-polyester blends, njll. |
Iphakheji
Umphongolo wepulasitiki ongu-120kg, ithangi le-IBC kanye nephakheji elenziwe ngezifiso liyatholakala ukuze likhethwe
AMACEBISO:
Izimiso zokudaya
Inhloso yokudaya ukukhiqiza umbala ofanayo we-substrate ngokuvamile ukuze uhambisane nombala okhethwe kusengaphambili.Umbala kufanele ufane kuyo yonke i-substrate futhi ube nomthunzi oqinile ngaphandle kokungalingani noma ukushintsha komthunzi phezu kwayo yonke i-substrate.Kunezici eziningi ezizothonya ukubonakala komthunzi wokugcina, okuhlanganisa: ukuthungwa kwe-substrate, ukwakhiwa kwe-substrate (kokubili kwamakhemikhali nangokomzimba), ukwelashwa kwangaphambili okufakwa ku-substrate ngaphambi kokudaya kanye nokwelashwa ngemuva kokusetshenziswa ngemuva kokudaya. inqubo.Ukusetshenziswa kombala kungafinyelelwa ngezindlela eziningi, kodwa izindlela ezintathu ezivame kakhulu ukudaya okuphumayo (i-batch), okuqhubekayo (i-padding) nokuphrinta.